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HEXUS at IDF Fall 2004 Part #2
Posted by Philipp on: 2004-09-08 17:15:42 [ Print | Permalink ]

Hexus.net has posted more coverage of IDF

Keynote: Mobility

"He started off his keynote talking about the change we have seen in the mobile computer since its first introduction, and the growth which we have seen since 2001. That is, in numbers from 25 million units a year to its current levels, almost double ? 47 million units.

The mobile market is different from the desktop market, it is more of a concentrated market. People have needs and wants from their mobile computers and it is important for these to be met, currently the market wants connectivity, performance, battery life, and form features."

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Memory - 667 and 800 DDR2, DDR3

"In 2006 we will again see a big change in the memory which Intel CPUs use, we will have DDR3 finally at the speeds of 800/1066. There will also be a FBDIMM module available. Intel will also try and EOL SDRAM in 2006. they will continue to support DDR 266 and RDRAM.. In Quarter 1 2005 we will see 667/800 DDR2 memory moving in to mainstream. Samsung have reported thay they already have the yields coming through all they need is the chipset support. We will see this in 925EX."

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NVIDIA

"Serial Data Interface (SDI) was a big part of their presentation. The SDI link on a Quadro FX4000 SDI allows realtime capture of the framebuffer or other video channels to allow for realtime video effects to be processed or overlayed, then output again in realtime video via a digital connection. The first example given by NVIDIA was realtime overlay of information on a broadcast television signal, using a single Quadro FX4000 SDI."

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Dual Core, Virtualisation and Power Saving

"Their first demonstration used two almost identically configured Xeon systems, one using DDR-II memory, the other using DDR, in a large density. The DDR-II-equipped system had a power draw some 100W less than the same DDR-equipped system. Spread over a large number of machines in your organisation and just the switch in memory types can save you lots of money and help with thermal design issues and other heat-related problems."

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