AMD EPYC 7000 series specs and more
Posted on: 06/16/2017 09:12 AM

Here a roundup of today's reviews and articles:

AMD EPYC 7000 series specs and performance leaked
Cougar Immersa
Intel Announces New Mesh Interconnect Architecture For Its Upcoming Xeon Scalable Processors
Intel mesh architecture announced for upcoming Xeons
LG G6 Review
Palit GeForce GTX 1050 Ti KalmX review: fully passive
SQL Server on Linux
The Microsoft Surface Pro (2017) Review: Evolution
Underside of AMD Ryzen Threadripper Pictured

AMD EPYC 7000 series specs and performance leaked
The EPYC 7000 series processors feature 128 PCIe lanes and 8-channel DDR4 support (up to 2666 MHz). Some parts are listed with two TDP values (right now I’m not sure why). EPYC CPUs are available with up 32 cores. The cheapest part should be available more than 400 USD and the most powerful EPYC 7601 processor will be sold for around 4000 USD. The highest clock speed is 3.2 GHz in turbo mode.


Read full article @ VideoCardZ

Cougar Immersa
The Cougar Immersa is an extremely comfortable, well-built, and fun-sounding gaming headset. It's equipped with a retractable microphone and supports all gaming platforms. Costing a mere $50, its price-performance ratio is simply amazing.


Read full article @ techPowerUp

Intel Announces New Mesh Interconnect Architecture For Its Upcoming Xeon Scalable Processors
Intel announced its family of Xeon Scalable Processors in early May, featuring the Skylake-SP microarchitecture. Those processors haven’t officially launched just yet, but today the chip giant is revealing one of the key technologies being leveraged in the Xeon Scalable Processor family. A new mesh interconnect architecture has been designed to increase bandwidth between on-chip elements, while simultaneously decreasing latency, and improving power efficiency and scalability...


Read full article @ HotHardware

Intel mesh architecture announced for upcoming Xeons
Aims to remove bottlenecks from incumbent ringbus architecture. A fully-fledged processor is far more than just an aggregation of cores. There needs to be a means of connecting the cores to external memory, IO - usually through PCIe or QPI - and the supporting L3 cache. In Intel-speak, this is known as connecting the core to the uncore.

Various companies use an in-house topology that forms this interconnect. In the case of Intel, as it pertains to Xeon processors, this core-wide interconnect is known as the ringbus architecture that was prevalent with the Sandy Bridge architecture way back in 2011.


Read full article @ Hexus

LG G6 Review
LG has lifted their game significantly this year with the all-new G6, a beautiful phone that doesn't try anything crazy, but it succeeds through proper use of materials and a seamless build.


Read full article @ TechSpot

Palit GeForce GTX 1050 Ti KalmX review: fully passive
Passive graphics cards are an excellent solution for those wanting a silent, but capable system. Palit is the first manufacturer to equip an Nvidia GeForce GTX 1050 Ti with a passive cooler. We've tested the silent GTX 1050 Ti KalmX.

The GeForce GTX 1050 Ti is a decent graphics card for gaming at a Full HD resolution, provided that you are content with medium to high settings. Furthermore the card has practically all the features that a media consumer would ask for, such as H.265-decoding (including 10-bit) and an HDMI 2.0 output. Therefore it's an ideal card to upgrade an older system for usage as a modern media center.


Read full article @ Hardware.Info

SQL Server on Linux
When Wim Coekaerts, Microsoft's vice president for open source, took the stage at LinuxCon 2016 in Toronto last summer, he came not as an adversary, but as a longtime Linux enthusiast promising to bring the power of Linux to Microsoft and vice versa. With the recent launch of SQL Server for Linux, Coekaerts is clearly having an impact.


Read full article @ Linux Journal

The Microsoft Surface Pro (2017) Review: Evolution
The Microsoft Surface Pro has undeniably carved out a new segment in the PC space. But what was once a powerful, but heavy, thick, and unwieldly tablet when it was first launched, has become a thin, light, and even more powerful tablet in the following years. It was really the launch of the Surface Pro 3 that finally changed Microsoft’s fortunes in the hardware game. This was the first Surface Pro that was able to bring the weight and thickness into check, and the 3:2 aspect ratio screen was a revelation in this product category where 16:9 or 16:10 displays were really all that was offered in the Windows world.

In October 2015, Microsoft launched the refreshed Surface Pro 4 which was a bigger improvement than you would have guessed. The overall dimensions and look of the tablet were similar to the Pro 3, but the display was a big step forward, offering 267 pixels per inch, and outstanding color reproduction. The new keyboard launched with the Surface Pro 4 was really one of the biggest highlights though, offering an edge to edge keyboard with island keys, and a far more useable trackpad as well.


Read full article @ Anandtech

Underside of AMD Ryzen Threadripper Pictured
AMD Ryzen Threadripper is a really big processor, and here's what its underside looks like. A multi-chip module (MCM) of two eight-core "Summit Ridge" dies, it is also AMD's first client-segment processor to feature a land-grid array (LGA) socket interface, with the pins being located on the motherboard, and contact-points on the CPU package. Until now, AMD has limited large LGA sockets to its enterprise processors. The processor is based on the 4,094-pin socket SP3r2, which is increasingly being referred to by motherboard and cooler manufacturers as "TR4."

Given that it is an MCM of two dies, you can see a clear dividing line between two groups of the contact points that make up the total pin count of 4,094 pins. There are also two distinct ancillary cutouts which holds critical electrical components for the dies above. Something like this is lacking on the socket AM4 Ryzen "Summit Ridge" processors, where the cutout is blank, and the ancillaries are located around the CPU die, on the other side of the fiberglass substrate. AMD Ryzen Threadripper could be available from 27 July.


Read full article @ techPowerUp




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