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Arctic Silver 5 Thermal Compound Review
Posted by Philipp Esselbach on: 01/30/2005 04:35 AM [ Print | 0 comment(s) ]
Mikhailtech take a look at the Arctic Silver 5 and run some initial and extended tests, comparing it to a stock Intel pad to see the difference.
Having recently tossed my near-empty tube of AS3, I noticed several differences between the two. From a packaging perspective, one complaint I had with the previous container was that it would always "leak". That is, the compound would be at the very tip every time which eventually caused a few messes. The new packaging suffers no such fate. Also, AS5 is a lot thicker and harder to spread. Surprisingly, what seems like a few grains of sand is more than enough to cover an entire P4 core after a few minutes of spreading. I prefer to use an index card, but a finger through a plastic sandwich bag will also work.
02/04/2003 02:45 AM: What the hell is with Arctic silver 3? (5) by t1n0m3n