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LGA 775 Prescott/Tejas Die Exposed
Posted by Philipp Esselbach on: 12/19/2003 06:46 AM [ Print | 0 comment(s) ]
VR-Zone gotten their hands on a LGA 775 Prescott/Tejas and they have decided to open up it up to check out the die.
The procedure of removing the IHS is similar to the current Pentium 4 as you would need a thin blade to slice through the rubber padding nicely and slowly. Though the usual procedure of removing the IHS from the P4 processor is easy but it is not the case for this LGA 775 Prescott. We find that the die is firmly adhered to the IHS making it hard to remove as there is some sort of solder-like thermal interface in between the surface of the die and the IHS.
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