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ZZZ Carbon black thermal paste article
Posted by Philipp Esselbach on: 07/31/2003 08:38 AM [ Print | 0 comment(s) ]
ZZZ has just published a new article detailing a huge new advance in thermal paste technology.
In tests comparing it to solder (a method of thermal transfer not typically used with electronic components because of the temperature required to bond it to both surfaces), the carbon paste surpassed the pure metal bond in thermal conductivity by 33%. It was also superior to diamond and carbon nanotube based pastes currently undergoing development.
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