Reviews 52663 Published by Philipp Esselbach 0

FrostyTech has posted a review on the Thermaltake Volcano 6Cu+ Heatsink review

Ever since the ORB shocked the cooling world with its shape and functionality the eyes of performance users have been glued on Thermaltake. While heatsinks like the Dragon Orb 3 have brought about some of the heaviest designs on the market one thing remains constant - copper, and the quest for absolute performance.

When used properly, copper can help increase the effectiveness of just about any heatsink design, but when misused it really only adds dead weight. With that in mind we are going to review the Volcano 6Cu+ and specifically the large copper slug in its' base to see how effective it really is.
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Reviews 52663 Published by Philipp Esselbach 0

I am Not a Geek dot com has posted a review on the Samsung SW-216

While you may have a 52x CD-ROM, the rating of 52X is a maximum rating, and on the inside tracks of the CD where the CD-ROM starts reading from, you are only going to get about 16x at the most. CD Recorders speeds are based on a CLV rating not a CAV rating like the most CD-ROMs past 8x, which means they burn at the same speed throughout the CD. So your 24x burner will actually start burning at 24x while your 52X CD-ROM is only starting to read at 16X, which will cause a buffer underrun error, but more likely your 24x burner has BURN Proof or Just Link enabled and your burner temporarily stops and waits for the CD-ROM to catch up and then resumes the burn, slowing the overall process.
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Reviews 52663 Published by Philipp Esselbach 0

FrostyTech has posted a review on the Thermal Integration TI-V77L Heatsink

Thermal Integration made a lot of waves in the cooling marketplace with their introduction of the Thermoengine earlier this year. If you recall, the Thermoengine had two particular traits which helped to make it one very capable performing heatsink. The first aspect was of course the hollow center which decreased the overall amount of heat energy stored in the cooler, and the second was its very efficient fin design.

The TI-V77L follows in those same foot steps and uses Thermal Integration's very efficient top-down design. The area under the fan motor is usually a dead spot for air flow and TI-V77L gets around this by using that section of material to transfer the heat from the processor throughout the body of the heatsink. Thus, all the cooling fins on the heatsink are located directly under the down draft created by the fan. As a further side benefit, the exhaust air blows directly down onto the top of the processor, adding further cooling into the mix.
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